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AMD to invest $400 million in India by 2028: Here’s what we know

US chipmaker Advanced Micro Devices said on Friday it will invest around $400 million in India over the next five years and will build its largest design center in the tech hub of Bengaluru. AMD’s announcement was made by its Chief Technology Officer Mark Papermaster at an annual semiconductor conference that started Friday in Prime Minister Narendra Modi’s home state of Gujarat. Other speakers at the flagship event include Foxconn Chairman Young Liu and Micron CEO Sanjay Mehrotra. Despite being a late entrant, the Modi government has been courting investments into India’s nascent chip sector to establish its credentials as a chipmaking hub. AMD said it will open its new design centre campus in Bengaluru by end of this year and create 3,000 new engineering roles within five years. “Our India teams will continue to play a pivotal role in delivering the high-performance and adaptive solutions that support AMD customers worldwide,” Papermaster said. The new 500,000-square-foot (55,5...
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MediaTek Filogic 130, Filogic 130A chipsets with Wi-Fi 6, Bluetooth 5.2 support launched for IoT devices

MediaTek just launched its Filogic 130 and Filogic 130A chips for IoT devices. The new chips integrate a microprocessor, AI engine, Wi-Fi 6 and Bluetooth 5.2 subsystems, along with a power management unit. Apart from this, MediaTek has also partnered with AMD to develop the RZ600 series Wi-Fi 6E modules, which feature the Filogic 330p chipset.

Apart from the microprocessor, AI engine and more, the Filogic 130A also comes with a digital audio signal processor, which will allow OEMs to add voice assistant support and other audio services in their IoT products.

MediaTek has claimed that the new Filogic chipsets are all-in-one solutions that deliver energy-efficient, reliable and high-performance connectivity in small form factor designs that are ideal for IoT devices.

MediaTek Filogic 130, Filogic 130A

Both the Filogic 130 and Filogic 130A support 1T1R Wi-Fi 6 connectivity, dual-band (2.4GHz and 5GHz) support, and other advanced Wi-Fi features including target wake time (TWT), MU-MIMO, MU-OFDMA, quality of service (QoS) and WPA3 Wi-Fi security.

Both the chipsets feature an ARM Cortex-M33 microcontroller paired with embedded RAM, external flash, and an integrated front-end module (iFEM). The Filogic 130A comes with an additional HiFi4 DSP, which offers support for more accurate far-field voice processing, always-on microphone capabilities with voice activity detection, and trigger word support.

AMD RZ600

MediaTek has partnered with AMD to create a new Wi-Fi solution for desktops and laptops. The new AMD RZ600 series Wi-Fi 6E module consists of the MediaTek Filogic 330P chipset. AMD has claimed that its new AMD RZ600 Wi-Fi solution will provide users with seamless high-speed Wi-Fi connectivity, reduced latency, and reduced interference.

The MediaTek Filogic 330P supports 2×2 Wi-Fi 6 (2.4GHz/5GHz), Wi-Fi 6E (6GHz band up to 7.125GHz), and Bluetooth 5.2 (BT/BLE). It also comes integrated with the company’s own power amplifier (PA) and low noise amplifier (LNA) technology, which helps optimise power consumption and reduce design footprint.

The post MediaTek Filogic 130, Filogic 130A chipsets with Wi-Fi 6, Bluetooth 5.2 support launched for IoT devices appeared first on BGR India.



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